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Compound Semiconductor
R&D,manufacturing and service provider.
Compound Semiconductor
R&D,manufacturing and service provider.
Compound Semiconductor
R&D,manufacturing and service
Compound Semiconductor
R&D,manufacturing and service
Company Profile
Xiamen Sanan Integrated Circuit Co., Ltd. ("SAIC" for short) is located in the Xiamen Torch High-Tech Industrial Development Zone, with a total investment of 500M USD on a planned area of 180,000 square meters. It is one of the major industrial projects of the province of Fujian in 2014-2018 and and key projects of the city of Xiamen in 2015 in an emerging industry of strategic importance with government support.
SAIC established a compound semiconductor manufacturing platform which combines process technologies for microwave radio frequency, high power electronics, and optical, by having in-house capability and vertical integration of substrate materials, epitaxy growth and wafer fabrication. SAIC owns large scale of MOCVD epitaxy growth production lines and the most advanced process technologies.
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SAIC is proud of highly reliable processes and extensive experience in wafer foundry, with professional R&D teams, both at home and abroad. SAIC offers the most competitive products with optimal manufacturing efficiency, focused on the development of high-end technologies for microwave radio frequency, power electronics and optical devices, and strives for developing leading processes and for constant improvements in process capabilities.<P> No Conflict Minerals Statement<P> Conflict Minerals Statement: Conflict Minerals( CM ) are designated for those minerals of tin, tantalum, tungsten and gold (3TGs) which originated in the Democratic Republic of Congo (DRC) or adjoining countries. Xiamen Sanan Integrated Circuit Co., Ltd (hereinafter referred to as Sanan-IC) does not purchase nor support the use of CM. Sanan-IC requires all suppliers not to purchase conflict minerals. Sanan-IC also asks suppliers to investigate the sources of those minerals of 3TGs from sub-tier suppliers.
Technology Service
Microwave Radio Frequency
In the field of radio frequency millimeter wave, SAIC has launched advanced process technologies for wireless applications such as GaAs HBT, pHEMT, and GaN HEMT, and has built a large-scale professional 4-inch and 6-inch compound wafer manufacturing line.
Power Electronics
In the field of power electronics, SAIC has launched SiC power diodes and silicon-based GaN power devices with high reliability and high power density.
Optical Communication
In the field of optical communications, SAIC has been capable of producing DFB lasers, photodiodes, avalanche photodiodes and other high-speed optical communication products, and has developed high-power visible and infrared VCSELs, edge-emitting lasers and other products including for 3D sensing, LiDar and other consumer applications.
01 Microwave Radio Frequency
02 Power Electronics
03 Optical Communication
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